Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

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This project aims to solve one of the reliability limitations facing the semiconductor and board mount industry today. Following Moore's law stating that the transistor density of an IC will double every 18 months, translates to an increased power dissipation two folds. With this, an alternativ...

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Detalles Bibliográficos
Publicado en:Philippine Engineering Journal 30, 2(3 copies) (2009(D)).
Autor Principal: Clemente, Richard Q.
Outros autores: Basilia, Blessie A.
Formato: Artigo
Idioma:English
Subjects:
Quad Flat No-lead.
SnAgCu(SAC).
Multi-walled carbon nanotube (MWCNT, CNT).
Finite Element Analysis (FEA).
Acceso en liña:Also available online for University of the Philippines Diliman. Click here