Clemente, R. Q., & Basilia, B. A. Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages. Philippine Engineering Journal.
芝加哥风格引文Clemente, Richard Q., 与 Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal .
MLA引文Clemente, Richard Q., 与 Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, .
警告：这些引文格式不一定是100％准确.