APA引文

Clemente, R. Q., & Basilia, B. A. Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages. Philippine Engineering Journal.

Chicago Style (17th ed.) Citation

Clemente, Richard Q., and Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal .

MLA引文

Clemente, Richard Q., and Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, .