APA (7. basım) Alıntı

Clemente, R. Q., & Basilia, B. A. Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages. Philippine Engineering Journal.

Chicago Style (17. basım) Atıf

Clemente, Richard Q., ve Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal .

MLA (9th ed.) Atıf

Clemente, Richard Q., ve Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, .