APA ציטוט

Clemente, R. Q., & Basilia, B. A. Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages. Philippine Engineering Journal.

Chicago Style (17th ed.) Citation

Clemente, Richard Q., and Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal .

ציטוט MLA

Clemente, Richard Q., and Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, .