Clemente, R. Q., & Basilia, B. A. Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages. Philippine Engineering Journal.
Lua i Stíl Chicago (17ú heag.)Clemente, Richard Q., agus Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal .
Lua MLA (9ú heag.)Clemente, Richard Q., agus Blessie A. Basilia. "Board Level Solder Joint Reliability and Finite Element Modeling of Carbon Nanotube Filled Leadfree Solder Alloy on QFN Packages." Philippine Engineering Journal, .
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