Three dimensional system integration IC stacking process and design
| Collectivité auteur: | |
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| Autres auteurs: | , , |
| Format: | Electronic Resource |
| Langue: | English |
| Publié: |
New York, London
Springer
2010
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| Sujets: | |
| Accès en ligne: | Available for the University of the Philippines Diliman via SpringerLink. Click here to access |


