Three dimensional system integration IC stacking process and design
| Autor Corporativo: | |
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| Otros Autores: | , , |
| Formato: | Electronic Resource |
| Lenguaje: | English |
| Publicado: |
New York, London
Springer
2010
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| Materias: | |
| Acceso en línea: | Available for the University of the Philippines Diliman via SpringerLink. Click here to access |


