Three dimensional system integration IC stacking process and design

Three dimensional system integration IC stacking process and design

Detalles Bibliográficos
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Papanikolaou, Antonis, Soudris, Dimitrios 1964-, Radojcic, Riko
Formato: Electronic Resource
Lenguaje:English
Publicado: New York, London Springer 2010
Materias:
Integrated circuit layout.
Electronic books.
Acceso en línea:Available for the University of the Philippines Diliman via SpringerLink. Click here to access