Reliability and intermetallic characterization of palladium-clad copper wire bond on aluminum pad under mixed stresses
Gold wire bonding is the most utilized process in microelectronic interconnects. But, the price of gold is constantly increasing. For this reason, several studies have considered copper as a potential low-cost alternative to gold because of its higher electrical conductivity and mechanical propertie...
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| Formatua: | Thesis |
| Hizkuntza: | English |
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