Mechilina, A. C. Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates.
Chicago Style (17th ed.) CitationMechilina, Aurelia Celebre. Comparative Study of Intermetallic Compound Formation in Sn-Ag-Cu and Eutectic Sn-Pb Solders on Bare Copper and Electroless Nickel Immersion Gold (ENIG) Substrates.
MLA (9th ed.) CitationMechilina, Aurelia Celebre. Comparative Study of Intermetallic Compound Formation in Sn-Ag-Cu and Eutectic Sn-Pb Solders on Bare Copper and Electroless Nickel Immersion Gold (ENIG) Substrates.
Warning: These citations may not always be 100% accurate.