Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates
The introduction of lead free materials (Sn-Ag-Cu solder in this study) in electronic packaging gives rise to new problems on the reliability of the solder joints since the addition of other constituents (Ag and Cu) plus the higher Sn content of the solder contribute to intermetallic precipitation i...
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| Format: | Thesis |
| Language: | English |
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