Packages go vertical.
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
| Foilsithe in: | IEEE spectrum 38, 8(duplicate) (2001). |
|---|---|
| Príomhchruthaitheoir: | |
| Formáid: | Alt |
| Teanga: | Béarla |
| Ábhair: |