Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Sonraí bibleagrafaíochta
Foilsithe in:IEEE spectrum 38, 8(duplicate) (2001).
Príomhchruthaitheoir: Goldstein, H.
Formáid: Alt
Teanga:Béarla
Ábhair: