Packages go vertical.
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
| Опубликовано в:: | IEEE spectrum 38, 8(duplicate) (2001). |
|---|---|
| Главный автор: | |
| Формат: | Статья |
| Язык: | английский |
| Предметы: |