Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Chi tiết về thư mục

Xuất bản năm:	IEEE spectrum 38, 8(duplicate) (2001).
Tác giả chính:	Goldstein, H.
Định dạng:	Bài viết
Ngôn ngữ:	English
Những chủ đề:	Cell phones. Chip stacking. Hearing aids. Implantable devices. Integrated circuits. Vertical packaging. Wearable computers.