Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Opis bibliograficzny

Wydane w:	IEEE spectrum 38, 8(duplicate) (2001).
1. autor:	Goldstein, H.
Format:	Artykuł
Język:	English
Hasła przedmiotowe:	Cell phones. Chip stacking. Hearing aids. Implantable devices. Integrated circuits. Vertical packaging. Wearable computers.