Packages go vertical.

Packages go vertical.

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Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Detalles Bibliográficos
Publicado en:IEEE spectrum 38, 8(duplicate) (2001).
Autor Principal: Goldstein, H.
Formato: Artigo
Idioma:English
Subjects:
Cell phones.
Chip stacking.
Hearing aids.
Implantable devices.
Integrated circuits.
Vertical packaging.
Wearable computers.