Introduction to system-on-package (SOP) miniaturization of the entire system

Detalles Bibliográficos
Autor Principal:	Tummala, Rao R. 1942-
Outros autores:	Swaminathan, Madhavan
Formato:	Libro
Idioma:	English
Publicado:	New York McGraw-Hill c2008.
Subjects:	Multichip modules (Microelectronics) > Design and construction. Microelectronic packaging.
Acceso en liña:	Table of contents only