Introduction to system-on-package (SOP) miniaturization of the entire system

Bibliographic Details
Main Author:	Tummala, Rao R. 1942-
Other Authors:	Swaminathan, Madhavan
Format:	Book
Language:	English
Published:	New York McGraw-Hill c2008.
Subjects:	Multichip modules (Microelectronics) > Design and construction. Microelectronic packaging.
Online Access:	Table of contents only