Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Bibliografiset tiedot
Muut tekijät: Cohn, Charles, Harper, Charles A.
Aineistotyyppi: Kirja
Kieli:English
Julkaistu: New York McGraw-Hill c2005.
Aiheet:
Microelectronic packaging.
Integrated circuits > Fault tolerance.