Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

书目详细资料
其他作者: Cohn, Charles, Harper, Charles A.
格式: 图书
语言:English
出版: New York McGraw-Hill c2005.
主题:
Microelectronic packaging.
Integrated circuits > Fault tolerance.