Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Bibliografski detalji
Daljnji autori: Cohn, Charles, Harper, Charles A.
Format: Knjiga
Jezik:English
Izdano: New York McGraw-Hill c2005.
Teme:
Microelectronic packaging.
Integrated circuits > Fault tolerance.