Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Detaylı Bibliyografya
Diğer Yazarlar: Cohn, Charles, Harper, Charles A.
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York McGraw-Hill c2005.
Konular:
Microelectronic packaging.
Integrated circuits > Fault tolerance.