Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Dades bibliogràfiques
Altres autors: Cohn, Charles, Harper, Charles A.
Format: Llibre
Idioma:English
Publicat: New York McGraw-Hill c2005.
Matèries:
Microelectronic packaging.
Integrated circuits > Fault tolerance.