Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Bibliografische gegevens
Andere auteurs: Cohn, Charles, Harper, Charles A.
Formaat: Boek
Taal:English
Gepubliceerd in: New York McGraw-Hill c2005.
Onderwerpen:
Microelectronic packaging.
Integrated circuits > Fault tolerance.