Cohn, C., & Harper, C. A. (2005). Failure-free integrated circuit packages: Systematic elimination of failures through reliability engineering, failure analysis, and material improvements. McGraw-Hill.
Citazione stile Chigago Style (17a edizione)Cohn, Charles, e Charles A. Harper. Failure-free Integrated Circuit Packages: Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements. New York: McGraw-Hill, 2005.
Citatione MLA (9a ed.)Cohn, Charles, e Charles A. Harper. Failure-free Integrated Circuit Packages: Systematic Elimination of Failures Through Reliability Engineering, Failure Analysis, and Material Improvements. McGraw-Hill, 2005.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.