An electromigration and thermal model of power wires for a priori high-level reliability prediction.

An electromigration and thermal model of power wires for a priori high-level reliability prediction.

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap...

Täydet tiedot

Bibliografiset tiedot
Julkaisussa:IEEE Transactions on VLSI systems 12, 4 (2004).
Päätekijä: Casu, M.R
Aineistotyyppi: Artikkeli
Kieli:English
Aiheet:
VLSI.
A priori high-level reliability prediction.
Chip area power supply interconnect prediction.
Complex systems-on-chip.
Electromigration model.
Electrothermal model.
Power wires.
Power-distribution.
Self-consistent roadmap projections.
Self-heating.
Statistical current model.