Data mining of printed-circuit board defects.
This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defect...
| Publicado no: | IEEE Transactions on robotics and automation 17, 2 (2001). |
|---|---|
| Autor principal: | |
| Formato: | Artigo |
| Idioma: | English |
| Assuntos: |