Data mining of printed-circuit board defects.

Data mining of printed-circuit board defects.

This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defect...

Ausführliche Beschreibung

Bibliographische Detailangaben
Veröffentlicht in:IEEE Transactions on robotics and automation 17, 2 (2001).
1. Verfasser: Kusiak, A.
Format: Artikel
Sprache:English
Schlagworte:
PCB defects.
SPC.
Assembly process.
Data mining.
Electronics assembly.
Experiment design.
Printed-circuit board defects.
Quality engineering.
Quality fault cause identification.
Solder balls.
Statistical process control.