Data mining of printed-circuit board defects.

Data mining of printed-circuit board defects.

This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defect...

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Vydáno v:IEEE Transactions on robotics and automation 17, 2 (2001).
Hlavní autor: Kusiak, A.
Médium: Článek
Jazyk:English
Témata:
PCB defects.
SPC.
Assembly process.
Data mining.
Electronics assembly.
Experiment design.
Printed-circuit board defects.
Quality engineering.
Quality fault cause identification.
Solder balls.
Statistical process control.