Data mining of printed-circuit board defects.
This paper discusses an industrial case study in which data mining has been applied to solve a quality engineering problem in electronics assembly. During the assembly process, solder balls occur underneath some components of printed circuit boards. The goal is to identify the cause of solder defect...
| الحاوية / القاعدة: | IEEE Transactions on robotics and automation 17, 2 (2001). |
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| المؤلف الرئيسي: | |
| التنسيق: | مقال |
| اللغة: | English |
| الموضوعات: |