Advanced MEMS packaging

Advanced MEMS packaging

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書目詳細資料
其他作者: Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
格式: 圖書
語言:English
出版: New York McGraw-Hill [2010]
主題:
Microelectromechanical systems.
Microelectronic packaging.
在線閱讀:Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access