Advanced MEMS packaging

Detalles Bibliográficos
Otros Autores:	Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Formato:	Libro
Lenguaje:	English
Publicado:	New York McGraw-Hill [2010]
Materias:	Microelectromechanical systems. Microelectronic packaging.
Acceso en línea:	Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access