Advanced MEMS packaging

Dades bibliogràfiques
Altres autors:	Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Format:	Llibre
Idioma:	English
Publicat:	New York McGraw-Hill [2010]
Matèries:	Microelectromechanical systems. Microelectronic packaging.
Accés en línia:	Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access