Advanced MEMS packaging

Bibliographic Details
Other Authors:	Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Format:	Book
Language:	English
Published:	New York McGraw-Hill [2010]
Subjects:	Microelectromechanical systems. Microelectronic packaging.
Online Access:	Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access