Advanced MEMS packaging

Advanced MEMS packaging

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书目详细资料
其他作者: Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
格式: 图书
语言:English
出版: New York McGraw-Hill [2010]
主题:
Microelectromechanical systems.
Microelectronic packaging.
在线阅读:Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access