Static electromigration analysis for on-chip signal interconnects.

With the increase in current densities, electromigration has become a critical concern in high-performance designs. Typically, electromigration has involved the process of time-domain simulation of drivers and interconnect to obtain average, root mean square (r.m.s.), and peak current values for eac...

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Bibliographic Details

Published in:	IEEE Transactions on computer-aided design of integrated circuits and systems 22, 1 (2003).
Main Author:	Blaauw, D.T
Format:	Article
Language:	English
Subjects:	Bidirectional current. Charge transfer. Circuit nodal formulation. High-performance designs. Industrial electromigration analysis tool. Linear equations. Microprocessor. Multiple simultaneous switching drivers. On-chip signal interconnects. Simultaneous switching drivers modeling. Static electromigration analysis. Switching scenarios. Unidirectional current. Wire segments.