Power to the package.
Electronic packaging technology focuses on where and how the silicon IC is connected into the electronic system. That makes a package the meeting place of a number of tradeoffs, whose constraining influence on what might and might not change will largely determine how the technology of the year 2003...
| Wydane w: | IEEE spectrum 36, 7 (1999). |
|---|---|
| 1. autor: | |
| Format: | Artykuł |
| Język: | English |
| Hasła przedmiotowe: |