Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Bibliografiset tiedot

Julkaisussa:	IEEE spectrum 38, 8 (2001).
Päätekijä:	Goldstein, H.
Aineistotyyppi:	Artikkeli
Kieli:	English
Aiheet:	Cell phones. Chip stacking. Hearing aids. Implantable devices. Integrated circuits. Vertical packaging. Wearable computers.