Packages go vertical.
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
| הוצא לאור ב: | IEEE spectrum 38, 8 (2001). |
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| מחבר ראשי: | |
| פורמט: | Article |
| שפה: | English |
| נושאים: |