Chip making's wet new world.

Chip making's wet new world.

Putting a drop of water between the lens and the silicon wafer allows a system to resolve lines a few hundred atoms wide. Researchers are counting on it to lift the technology from its last legs and carry it through the end of the decade.

Bibliographic Details
Published in:IEEE spectrum 41, 5 (2004).
Main Author: Geppert, L.
Format: Article
Language:English
Subjects:
IC sites.
Immersion lithography.
Light beam.
Lithographic system.
Optical lithography.
Optical wavelength reduction.
Refractive index.
Wafer packaging.