Flat, cheap, and under control [electrochemical mechanical planarization].

This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP is the answer to the problems of electropolishing and chemical mechanical planarization (CMP) of the chip-making process: manufacturing faster, more powerful chips wi...

詳細記述

書誌詳細

出版年:	IEEE spectrum 42, 1 (2005).
第一著者:	Brown, A.S
フォーマット:	論文
言語:	English
主題:	Chemical mechanical planarization. Chip-making process. Electrochemical mechanical planarization. Electropolishing. Fragile insulation material. Wafer polishing technology.