Flat, cheap, and under control [electrochemical mechanical planarization].

Flat, cheap, and under control [electrochemical mechanical planarization].

This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP is the answer to the problems of electropolishing and chemical mechanical planarization (CMP) of the chip-making process: manufacturing faster, more powerful chips wi...

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Publicat a:IEEE spectrum 42, 1 (2005).
Autor principal: Brown, A.S
Format: Article
Idioma:English
Matèries:
Chemical mechanical planarization.
Chip-making process.
Electrochemical mechanical planarization.
Electropolishing.
Fragile insulation material.
Wafer polishing technology.