Flat, cheap, and under control [electrochemical mechanical planarization].

This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP is the answer to the problems of electropolishing and chemical mechanical planarization (CMP) of the chip-making process: manufacturing faster, more powerful chips wi...

Ful tanımlama

Detaylı Bibliyografya

Yayımlandı:	IEEE spectrum 42, 1 (2005).
Yazar:	Brown, A.S
Materyal Türü:	Makale
Dil:	English
Konular:	Chemical mechanical planarization. Chip-making process. Electrochemical mechanical planarization. Electropolishing. Fragile insulation material. Wafer polishing technology.