Flat, cheap, and under control [electrochemical mechanical planarization].

This paper describes Applied Material's wafer polishing technology, called electrochemical mechanical planarization (ECMP). ECMP is the answer to the problems of electropolishing and chemical mechanical planarization (CMP) of the chip-making process: manufacturing faster, more powerful chips wi...

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Vydáno v:	IEEE spectrum 42, 1 (2005).
Hlavní autor:	Brown, A.S
Médium:	Článek
Jazyk:	English
Témata:	Chemical mechanical planarization. Chip-making process. Electrochemical mechanical planarization. Electropolishing. Fragile insulation material. Wafer polishing technology.