Moore's law meets its match (system-on-package).

Moore's law meets its match (system-on-package).

This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...

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Pubblicato in:IEEE spectrum 43, 6 (2006).
Autore principale: Tummala, R.R
Natura: Articolo
Lingua:English
Soggetti:
Georgia Institute of Technology.
IC.
Microsystems Packaging Research Center.
SOP approach.
Discrete components.
Handhelds.
Megafunction electronics.
Micrometer-scale thin-film versions.
System miniaturization.
System-on-package approach.
Transistors.