Moore's law meets its match (system-on-package).
This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...
| הוצא לאור ב: | IEEE spectrum 43, 6 (2006). |
|---|---|
| מחבר ראשי: | |
| פורמט: | Article |
| שפה: | English |
| נושאים: |