Moore's law meets its match (system-on-package).

Moore's law meets its match (system-on-package).

This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...

Täydet tiedot

Bibliografiset tiedot
Julkaisussa:IEEE spectrum 43, 6 (2006).
Päätekijä: Tummala, R.R
Aineistotyyppi: Artikkeli
Kieli:English
Aiheet:
Georgia Institute of Technology.
IC.
Microsystems Packaging Research Center.
SOP approach.
Discrete components.
Handhelds.
Megafunction electronics.
Micrometer-scale thin-film versions.
System miniaturization.
System-on-package approach.
Transistors.