Moore's law meets its match (system-on-package).
This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...
| الحاوية / القاعدة: | IEEE spectrum 43, 6 (2006). |
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| المؤلف الرئيسي: | |
| التنسيق: | مقال |
| اللغة: | English |
| الموضوعات: |