Moore's law meets its match (system-on-package).

This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...

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Библиографические подробности

Опубликовано в::	IEEE spectrum 43, 6 (2006).
Главный автор:	Tummala, R.R
Формат:	Статья
Язык:	English
Предметы:	Georgia Institute of Technology. IC. Microsystems Packaging Research Center. SOP approach. Discrete components. Handhelds. Megafunction electronics. Micrometer-scale thin-film versions. System miniaturization. System-on-package approach. Transistors.