Microelectronic packaging for retinal prostheses.

An innovative parylene-based high-density chip-level integrated interconnect (CL-I2) packaging system for retinal implants id discussed. The implications of this CL-I2 technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create el...

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Veröffentlicht in:	IEEE Engineering in medicine and biology magazine 24, 5 (2005).
1. Verfasser:	Rodger, D.C
Format:	Artikel
Sprache:	English
Schlagworte:	High-density electrode arrays. Innovative parylene-based high-density chip-level integrated interconnect packaging system. Microelectronic packaging. Microfabrication. Photolithography. Retinal implants. Retinal prostheses.