Electrochemical migration of silver in electronics applications
Silver (Ag) filler is the most attractive choice among all the conductive fillers or die attached material because of its balanced properties and relatively low cost. However, a major problem of silver is that electrochemically migrates in the presence of moisture and applied bias in IN microelectro...
| Tác giả chính: | |
|---|---|
| Định dạng: | Luận văn |
| Ngôn ngữ: | English |
| Được phát hành: |
2009.
|
| Những chủ đề: |