Parametric study of immersion-Sn plating on Cu effect on reaction kinetics and porosity of deposit
Immersion-Sn is a Pb-free final finish that combines the low cost and process simplicity of organic solderability preservative (OSP) and the surface conductivity of electroless nickel immersion gold (ENIG). It deposits a thin, uniform, and planar Sn layer on Cu following an ion-replacement mechanism...
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| Formato: | Thesis |
| Idioma: | English |
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2009
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