Parametric study of immersion-Sn plating on Cu effect on reaction kinetics and porosity of deposit
Immersion-Sn is a Pb-free final finish that combines the low cost and process simplicity of organic solderability preservative (OSP) and the surface conductivity of electroless nickel immersion gold (ENIG). It deposits a thin, uniform, and planar Sn layer on Cu following an ion-replacement mechanism...
| প্রধান লেখক: | |
|---|---|
| বিন্যাস: | গবেষণাপত্র |
| ভাষা: | English |
| প্রকাশিত: |
2009
|
| বিষয়গুলি: |