Parametric study of the reactive ion etching of silicon
The demand for smaller yet faster and more powerful tools has been the primary driving force for device miniaturization and ultra large scale integration. As the density of device components increases, so does the device complexity. To keep pace with the technological requirements, stricter process...
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| Format: | Praca dyplomowa |
| Język: | English |
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2008.
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| Hasła przedmiotowe: |