$Understanding the effect of surface flaws on fracture of silicon die$
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Understanding the effect of surface flaws on fracture of silicon die

Detalhes bibliográficos
Autor principal:	Punzalan, Jaime C.
Formato:	Tese
Idioma:	English
Publicado em:	2003.
Assuntos:	Fracture mechanics. Fractography. Materials > Cracking > Measurement. Semiconductor wafers. Silicon crystals.