APA-viite (7. p.)

Tummala, R. R., Rymaszewski, E. J., & Klopfenstein, A. G. (1997). Microelectronics packaging handbook (2nd ed.). Chapman & Hall.

Chicago-viite (17. p.)

Tummala, Rao R., Eugene J. Rymaszewski, ja Alan G. Klopfenstein. Microelectronics Packaging Handbook. 2nd ed. New York: Chapman & Hall, 1997.

MLA-viite (9. p.)

Tummala, Rao R., et al. Microelectronics Packaging Handbook. 2nd ed. Chapman & Hall, 1997.