Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Библиографические подробности
Другие авторы: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Формат: ‌
Язык:English
Опубликовано: Park Ridge, N.J. Noyes c1993.
Предметы:
Integrated circuits > Design and construction.
Metallizing.