Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Handbook of multilevel metallization for integrated circuits materials, technology, and applications

Bibliografski detalji
Daljnji autori: Wilson, Syd R., Tracy, Clarence J., Freeman, John L.
Format: Knjiga
Jezik:English
Izdano: Park Ridge, N.J. Noyes c1993.
Teme:
Integrated circuits > Design and construction.
Metallizing.